Zmation Announces Wafer Die Vision Inspection System

August 9, 1996 — Portland, OR, USA—Zmation, Inc. announced today the availability of a new Wafer Die Vision Inspection System. This system was specifically designed to verify that “good” die have been picked from a wafer and that no “bad” die have been picked. Additionally, this system can be configured to meet many wafer and die inspection or verification requirements.

The system incorporates a Cognex vision board and proprietary algorithms to perform the necessary intelligent inspection. It is connected to a “host” computer system to receive wafer maps directly via a barcode scanner. The system provides an OLE 2.0 interface operating in a Windows environment.

The system comes complete with an IBM compatible computer, Cognex Vision processor, wafer fixture, backlight illumination, Sony XC-75 camera, lens, barcode scanner, and proprietary Zmation operations software. The system can be used for 6″ and 8″ wafers and can be custom configured for 12″ wafers. This system configuration sells for approximately $ 40,000.00.

Additional applications and options can be configured on this system to allow wafer carrier to wafer carrier transportation, good die removal, waffle pack loading or inspection, etc

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