Zmation Announces VHTP for Underfill Applications

February 19, 1996 — Portland, OR, USA—Zmation, Inc. announced today the availability of a new specialized Vacuum Heated Tooling Plate (VHTP) specifically designed for Direct Chip Attach (DCA) epoxy underfill dispensing applications. This device provides the ability to hold thin (.002″) plastic (PET, PIN, etc.) sheets or thick ceramic substrates in position while providing the necessary heat to allow capillary underfill for DCA applications. The epoxy underfill is used for TCE match, mechanical strength, and hermeticity for the finalized component.

Vacuum is provided to the VHTP via an adjustable vacuum venturi device at ~22″ Hg through small orifices on the plates top surface. Heat is provided to the plate via a flexible contact heater with complete closed loop temperature control. The typical temperature range for the plate is 50-150° C (+/- 5° C over the entire plate) but customized temperature ranges are available. The standard VHTP size has a work envelope of 12″ X 12″ but larger or smaller sizes are available upon request.

The VHTP is generally used in conjunction with the Zmation, Inc. Universal Automation Platform for dispensing applications. In addition to underfill epoxy dispensing, the Universal Platform can be used for chip coating (glob-top), adhesive, epoxy, solder paste, and other dispensing applications. This Platform can also be used for other highly process intensive applications such as; die attach, machine vision inspection, soldering, small parts assembly, etc.